| (Specifications) | ||
| Model No. | DS-250B | DS-300B |
| Control Method | Switching Control | |
| PCB Size(mm) | Max.250mm Max.300mm | |
| Conveyor Speed | 100~2400mm/min. | |
| Pre-heating Zone | Length:1050mm×1 Room Temperature-200℃ | |
| Solder Pot Temperature | Room Temperature~300℃ | |
| PCB Conveyor Direction | L R/L R | |
| PCB Conveyor Height | 750±20mm | |
| PCB Soldering Angle | 4~6° | |
| Flux Spraying Pressure/Flow Rate | 3-4kgf/cm2 10~100ml/min. | |
| Flux Capacity | Approx.4Liters | |
| Spraying Nozzle Move | Stepper Motor | |
| Solder Pot Capacity | Approx.220kg Approx.265kg | |
| Solder Type | Normal Solder | |
| Normal Power/Start up Power | Approx.2.5kw/11.5kw Approx.3kw/13.5kw | |
| Power Supply | 3 phase 5 wires 380V 50/60Hz | |
| Outside Dimension | L3150×W900×H1500mm | |
| Weight | 500kg | 550kg |
| 技術參數 | ||
| 型號 | DS-250B | DS-300B |
| 控制方式 | 按鍵式控制系統 | |
| PCB板尺寸 | Max.250mm Max.300mm | |
| 傳輸速度 | 100~2400mm/min. | |
| 預加熱區 | 長度:1000mm×1 溫度:室溫-200℃ | |
| 錫爐溫度 | 室溫~300℃ | |
| PCB板傳送方向 | L R/L R | |
| PCB板傳送高度 | 750±20mm | |
| PCB板過錫角度 | 4~6° | |
| 松香噴霧氣壓/流量 | 3-4kgf/cm2 10~100ml/min. | |
| 松香容量 | Approx.4Liters | |
| 噴頭移動方式 | 步進電機 | |
| 錫爐容量 | Approx.220kg | Approx.265kg |
| 適用焊料類型 | 普通焊料 | |
| 正常/啟動功率 | Approx.3.5kw/12.5kw Approx.4kw/13.5kw | |
| 電源 | 三相五線制 | |
| 設備外形尺寸 | L3150×W900×H1500mm | |
| 重量 | 500kg | 550kg |
DS-250B.DS-300B經濟型雙波峰焊錫機
產品特點
★ 爐膽采用分體型設計，小容量、小功率，單獨溫度控制，經濟實用，省電40％。
★特別加長預熱區，預熱曲線平穩，保證PCB板焊接效果。
★采用速度自行跟蹤噴霧系統（三菱PLC控制），使噴霧面積隨PCB寬度自動調節。
★ 內置助焊劑噴頭自動清洗系統，長期使用亦無需清洗。
★具有經濟運行功能，錫波隨PCB自動起降，降低氧化量。
★錫渣正常工作氧化量＜1.5公斤/8小時。
DS-250B .DS-300B Direct Dual-wave Soldering machine
Features
Solder pot adopts separate type design,small capacity,low power,independent temperature control,economical and practical, saving electricity by 40%.
Specially extended preheating area, where the preheating profile is stable and can ensure the soldering effect of PCB boards.
Adopting speed auto-track spraying system(Mitsubishi PLC control),making the spraying area automatically adjusted with the width of PCB.
Embeded cleaning system for flux nozzle head, no cleaning is requried even after used for a long time.
With economical operation function, the wave rises and falls with PCB and the quantity of oxidation is reduced.
Normal oxidation quantity of the lead-free soldering is＜1.5kg/8h.
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