| PCB Size(mm) | Max.250mm Max.300mm | ||
| Conveyor Speed | 100~2400mm/min. | ||
| Pre-heating Zone | Length:900mm×1 Room Temperature-200℃ | ||
| Solder Pot Temperature | Room Temperature~300℃ | ||
| PCB Conveyor Direction | L R/L R | ||
| PCB Conveyor Height | 750±20mm | ||
| PCB Soldering Angle | 4~6° | ||
| Flux Spraying Pressure/Flow Rate | 3-4kgf/cm2 10~100ml/min. | ||
| Flux Capacity | Approx.4Liters | ||
| Spraying Nozzle Move | Stepper Motor | ||
| Solder Pot Capacity | Approx.130kg Approx. 150kg | ||
| Solder Type | Normal Solder | ||
| Normal Power/Start up Power | Approx.2kw/7.5kw Approx.2.5kw/9kw | ||
| Power Supply | 3 phase 5 wires 380V 50/60Hz | ||
| Outside Dimension | L2800×W850×H1500mm | ||
| Weight | 450kg | 500kg | |
| 型號 | DS-250C | DS-300C | ||
| 控制方式 | 按鍵式控制系統 | |||
| PCB板尺寸 | Max.250mm Max.300mm | |||
| 傳輸速度 | 100~2400mm/min. | |||
| 預加熱區 | 長度:900mm×1 溫度:室溫-200℃ | |||
| 錫爐溫度 | 室溫~300℃ | |||
| PCB板傳送方向 | L R/L R | |||
| PCB板傳送高度 | 750±20mm | |||
| PCB板過錫角度 | 4~6° | |||
| 松香噴霧氣壓/流量 | 3-4kgf/cm2 10~100ml/min. | |||
| 松香容量 | Approx.4Liters | |||
| 噴頭移動方式 | 步進電機 | |||
| 錫爐容量 | Approx.130kg Approx. 150kg | |||
| 適用焊料類型 | 普通焊料 | |||
| 正常/啟動功率 | Approx.2kw/7.5kw Approx.2.5kw/9kw | |||
| 電源 | 三相五線制 | |||
| 設備外形尺寸 | L2800×W850×H1500mm | |||
| 重量 | 450kg | 500kg | ||
DS-250C.DS-300C經濟型單波峰焊錫機
產品特點：
★ 爐膽采用小容量、小功率設計，經濟實用，省電40％。
★ 特別加長預熱區，預熱曲線平穩，保證PCB板焊接效果。
★ 采用速度自行跟蹤噴霧系統（三菱PLC控制），使噴霧面積隨PCB寬度自動調節。
★ 內置助焊劑噴頭自動清洗系統，長期使用亦無需清洗。
★具有經濟運行功能，錫波隨PCB自動起降，降低氧化量。
★錫渣正常工作氧化量＜1.0公斤/8小時。
DS--250C .300C Direct Single-Wave Crest Soldering machine
Features:
Solder pot adopts small capacity, low power design, economical and practical, saving electricity by 40%.
Specially extended preheating area, where the preheating profile is stable and can ensure the soldering effect of PCB boards.
Adopting speed auto-track spraying system(Mitsubishi PLC control),making the spraying area automatically adjusted with the width of PCB.
Embeded cleaning system for flux nozzle head, no is requried even after used for a long time.
With economical operation function, the wave rises and falls with PCB and the quantity of oxidation is reduced.
Normal oxidation quantity of the lead-free soldering is＜1.0kg/8h.
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